LGTM-3968 Array Automatic Dipping Machine

LGTM-3968 Array Automatic Dipping Machine
LGTM-3968 Array Automatic Dipping Machine
LGTM-3968
Product Description

Application for chips terminal dipping of passive components, for multiple terminals dipping.
Carrier Array Thin Carrier Plate, ATCP
Chips specification 0204 and above
Capacity Depends on chips’ specification which will affect capacity.
  • Dipping cycle time: 30 sec (cycle time, involving loading and unloading time)
  • ATCP holes: 1030 holes/ pc
  • Capacity: 61,800 pcs (1030 pcs/plate×〔60sec÷(30 sec/cycle time×2 sides/pcs)〕×60min/hr=61,800


Q'ty :
  • LGTM-3968 Array Automatic Dipping Machine
  • LGTM-3968 Array Automatic Dipping Machine
Enlargement

 

Product Character

Operational Process

Inserting chips→Leveling→Dipping first side→Drying→Transferring→Leveling→Dipping second side→Drying→Unloading (Completed)

Technical Precision

  1. ATCP hole position precision: ±0.015mm
  2. Parallelism tolerance between dipping plate and ink tray:±0.01mm
  3. Paste thickness precision:±0.015mm
  4. Action precision:±0.001mm

Machine Specification

  1. Dimension: 2650 (L)*1200 (W)*2100 (H)mm
  2. Weight: 1380KGS

Electric Control

  1. Controller: PLC, HMI, Servo Motor…
  2. Voltage: 220V(380V), customable
  3. Electric current: 25(A)
  4. Power consumption: 5.5(KW)
  5. Frequency: 50/60Hz
  6. Air Consumption: 32 (l/min)

Associated Equipments:

Inserting M/C, Bottom Air Press, Level Air Press, Press Plate, Bottom Press Conversion, Paste Plate, TCP, Lord Plate, Transfer Plate, Unloading Plate and Storage Box.

If you need more detail specification and function in advance, please contact us.